tmp47c222/422 i 2008-03-06 document change notification the purpose of this notification is to inform customers about the launch of the pb-free version of the device. the introduction of a pb-free replacement affects the datasheet. please understand that this notification is intended as a temporary substitute for a revision of the datasheet. changes to the datasheet may include the followin g, though not all of them may apply to this particular device. 1. part number example: tmpxxxxxxf tmpxxxxxxfg all references to the previous part number were left unchanged in body text. the new part number is indicated on the prelims pages (cover page and this notification). 2. package code and package dimensions example: lqfp100-p-1414-0.50c lqfp100-p-1414-0.50f all references to the previous package code and package dimensions were left unchanged in body text. the new ones are indicated on the prelims pages. 3. addition of notes on lead solderability now that the device is pb -free, notes on lead solderability have been added. 4. restrictions on product use the previous (obsolete) provision might be left unchanged on page 1 of body text. a new replacement is included on the next page. 5. publication date of the datasheet the publication date at the lower right corner of the prelims pages applies to the new device.
tmp47c222/422 ii 2008-03-06 1. part number 2. package code and dimensions previous part number (in body text) previous package code (in body text) new part number new package code otp tmp47c222n p-sdip42-600-1.78 tmp47c222ng sdip42-p-600-1.78 tmp47p422vng tmp47c422n p-sdip42-600-1.78 tmp47c422ng sdip42-p-600-1.78 tmp47p422vng tmp47c222f p-qfp44-1414-0.80d tmp47c222fg qfp44-p-1414-0.80k tmp47p422vfg tmp47c422f p-qfp44-1414-0.80d TMP47C422FG qfp44-p-1414-0.80k tmp47p422vfg tmp47c222u p-qfp44-1010-0.80 tmp47c222ug lqfp44-p-1010-0.80a tmp47p422vug tmp47c422u p-qfp44-1010-0.80 tmp47c422ug lqfp44-p-1010-0.80a tmp47p422vug * : for the dimensions of the new package, see the attached package dimensions diagram. 3. addition of notes on lead solderability the following solderability test is conducted on the new device. lead solderability of pb-free devices (with the g suffix) te s t te s t c o n d i t i o n s r e m a r k solderability (1) use of lead (pb) solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of lead (pb)-free solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux leads with over 95% solder coverage till lead forming are acceptable.
tmp47c222/422 iii 2008-03-06 4. restrictions on product use the following replaces the ?restrictions on product use? on page 1 of body text. 5. publication date of the datasheet the publication date of this datasheet is printed at the lower right corner of this notification. restrictions on product use 20070701-en ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity a nd vulnerability to physical stress. it is the responsibility of t he buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshib a products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconduct or devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are intend ed for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipmen t, industrial robotics, domestic appliances, etc.).these toshiba products are neither intended nor warranted for us age in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instrument s, traffic signal instruments, combus tion control instruments, medical instruments, all types of safety devices, etc.. uninte nded usage of toshiba products listed in his document shall be made at the customer?s own risk. ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. ? the information contained herein is presented only as a gui de for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third partie s which may result from its use. no license is granted by implicat ion or otherwise under any patents or other rights of toshiba or the third parties. ? please contact your sales representative for produc t-by-product details in this document regarding rohs compatibility. please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of cont rolled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. ? for a discussion of how the reliability of microcontrollers c an be predicted, please refer to section 1.3 of the chapter entitled quality and reliability assurance/handling precautions.
tmp47c222/422 iv 2008-03-06 (annex) package dimensions sdip42-p-600-1.78 unit: mm
tmp47c222/422 v 2008-03-06 lqfp44-p-1010-0.80a unit: mm
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